Project leader
ARCSISPartners
ST Microelectronics, BIOPHY Research, TERA Environnement, ATMELNBS Technologies, PROBIONIBS (Ion Beam Services), GEMALTO, ST-NXP Wireless France, Institut TELECOM ParisTech, Université de Provence, IM2NP, Université de Nice Sophia Antipolis, LEAT, EURECOM, ENSME-SEFunders
Other,
CIM PACA 2011
The second CIMPACA 2011 research program planned over 3 years (2009 – 2010 – 2011) follows the first CIMPACA 1 program carried out over the 3 years 2006-2007-2008, both by reinforcing the resources of the themes of the first program and by optimizing their services, and increasing the scientific perimeter by the new themes related to 3DSiP (System In Package) technologies, available in both silicon (WLP) and chip versions in polymers and organic electronics.