Project leader

Kemesys

Partners

Atmel, Vegatec, Rockwood Wafer, Reclaim, St Microelectronics, DPPE UMR 6181 CNRS-UPCAM

Funders

FUI,

MERISIER

Innovative Slurries Repackaging Method for the Regional Electronics Industry


Develop an innovative method of reconditioning slurries.

Project leader

Kemesys

Partners

Atmel, Vegatec, Rockwood Wafer, Reclaim, St Microelectronics, DPPE UMR 6181 CNRS-UPCAM

Funders

FUI,
Themes Markets R&D Investment Duration Funding Year
Microelectronics
Other
2467 K€ 24 months 2008
Themes
Microelectronics
Markets
Other
R&D Investment
2467 K€
Duration
24 months
Funding Year
2008

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