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OSIRIS

Ultrasound probe card cleaner and selective etching.

Study and development of a “selective etching” cleaning and micro-machining machine: Ultrasonic, without mechanical contact of test card tips for the electrical sorting of semiconductor wafers.

The process is based on ultrasound generation in water at very high frequency, its advantage is the absence of mechanical stresses harmful to the structure and geometry of the test tips, it offers the possibility of reshaping those without deforming them.

The benefit is increased card life, improved sorting efficiencies and lower Test costs.